仕様
SMDコンポーネントの種類:TSOP I
PCB材質:エポキシ樹脂ガラス積層
辺数:2
寸法:43.5 x 16.5 x 1.5mm
銅箔厚さ:35μm
穴径:1mm
ホールピッチ:0.65 x 0.65mm
FR材質グレード:FR4
長さ:43.5mm
厚さ:1.5mm
幅:16.5mm
TSOP I/II Adaptor Boards, RE900. 1.5 mm FR4 epoxy, 35 μm CU on both sides Plated drill holes, O 1 mm Soldering and component side surface made of chem. nickel/gold (Ni/Au) and solder mask Pre-scored breaking points for detaching individual modules from the board Size 72.6 x 76.2 mm Adaption board for 14 different SMD TSOP I and 7 different SMD TSOP II chips